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PCN165104: Qualification of ZKT as an Alternate Assembly Site for Select Stacked Die 16-Lead SOIC Packages with Spacers and Copper Wire Bond | Cypress Semiconductor

PCN165104: Qualification of ZKT as an Alternate Assembly Site for Select Stacked Die 16-Lead SOIC Packages with Spacers and Copper Wire Bond

Last Updated: 
Oct 11, 2017

 Issue Date: December 23, 2016

Effectivity Date: March 23, 2017

Qualification of ZKT as an Alternate Assembly Site for Select Stacked Die 16-Lead SOIC Packages with Spacers and Copper Wire Bond