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PCN115027 | Cypress Semiconductor

PCN115027

Last Updated: 
Oct 24, 2017

Qualification of a new assembly bill of materials and Amkor Korea as an Additional Assembly Site for 16-lead QFN COL (3X3X0.6 mm) Package Products Using the Saw Singulation Process.

Issue Date: 04-May-11
Effectivity Date: 04-May-11