PCN074596 | Cypress Semiconductor
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Assembled at AIT
Issue Date: 22-Dec-07
Effectivity Date: 01-Mar-08
|File Title||Language||Size||Last Updated|
|PCN074596 Affected Parts List.xls||English||32.5 KB||10/13/2017|
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