PCN074596 | Cypress Semiconductor
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Assembled at AIT
Issue Date: 22-Dec-07
Effectivity Date: 01-Mar-08
|File Title||Language||Size||Last Updated|
Need help? Ask a question and find answers in the Cypress Developer Community Forums.
Low/intermittent bandwidth users tip: Firefox and Chrome browsers will allow downloads to be resumed if your connection is lost during download.