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PCN074593 | Cypress Semiconductor

PCN074593

Last Updated: 
Oct 13, 2017

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 119 ball 14x22x2.4mm BGA Packages Using SnAgCu Solder Balls

Issue Date: 20-Dec-07
Effectivity Date: 01-Mar-08