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PCN074590 | Cypress Semiconductor

PCN074590

Last Updated: 
Oct 12, 2017

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 256 ball 17x17x1.7mm BGA Packages Using Sn98.5%Ag1%Cu0.5% Solder Balls

Issue Date: 17-Dec-07
Effectivity Date: 01-Feb-08