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PCN074585 | Cypress Semiconductor

PCN074585

Last Updated: 
Oct 12, 2017

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 60 ball 8x20x1.2mm BGA Packages Using SnAgCu Solder Balls

Issue Date: 05-Dec-07
Effectivity Date: 01-Mar-08