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PCN071531 | Cypress Semiconductor

PCN071531

Last Updated: 
Oct 12, 2017

Qualification of KE-G2270/Kyocera Green mold compound and Ablestik 2025D Die
Attach for 48FBGA, Pb-Free package assembled at Advanced Semiconductor Engineering
(ASE-Taiwan)

Issue Date: 31-Jul-07
Effectivity Date: 31-Jul-07