PCN071530 | Cypress Semiconductor
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
Issue Date: 20-Jul-07
Effectivity Date: 01-Oct-07
|File Title||Language||Size||Last Updated|
|PCN071530 Affected Parts List.xls||English||34 KB||10/12/2017|
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