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PCN061082 | Cypress Semiconductor

PCN061082

Last Updated: 
Oct 23, 2017

8M MoBLTM SRAM Process Technology Transition from R8NLD-18 (0.13 micron) to R95LD-3R (90-nanometer), Lead-free packages(RoHS Compliant) on 48 ball BGA (Ball Grid Array) and 44 pin TSOP II (Thin Shrunk Outline Package)

Issue Date: 4/22/2006
Effectivity Date: 5/7/2006