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PCN061008 | Cypress Semiconductor

PCN061008

Last Updated: 
Oct 15, 2017

Change of die thickness from 11 mils to 7 mils for R9 72M (Large Die) assembled in TQFP 100 leads, 14 x 20 x 1.4 mm package

Issue Date: 20-Mar-2006

Effectivity Date: 1-Jun-2006