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PCN061003 | Cypress Semiconductor

PCN061003

Last Updated: 
Oct 23, 2017

2M MoBLTM SRAM Process Technology Transition from R52LD-3 (0.25 micron) to R95LD-3R (90-nanometer), Lead-free package on 44 pin TSOP II (Thin Shrunk Outline Package), 36/48-ball VFBGA (Very Fine Ball Grid Array)

Issue Date: 28-Feb-2006

Effectivity Date: 9-May-2006