You are here

PCN050897 | Cypress Semiconductor

PCN050897

Last Updated: 
Oct 23, 2017

4M MoBLTM SRAM Process Technology Transition to R95LD-3R (90-nanometer) from R52LD-5R (0.25 micron), Lead-free packages on 32 pin TSOP-II (Thin Shrunk Outline Package) and 32 pin SOIC (Small Outline Integrated Circuit)

Issue Date: 9-Jan-2006  
Effectivity Date: 7-Feb-2006