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16 - QFN (3 X 3 X 0.6 MM) CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET | Cypress Semiconductor

16 - QFN (3 X 3 X 0.6 MM) CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET

Last Updated: 
May 30, 2017
Version: 
*O

Package Material Declaration Datasheet (PMDD) is a declaration data developed by component manufacturers to standardize the material declaration based from
the Materal Safety Datasheet (MSDS) of every materials use on the product