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IPC1752 MATERIAL DECLARATION486 BGA (6X8 MM) (BZ48) CML SnAgCu Au Wire Low Alpha mold compound | Cypress Semiconductor

IPC1752 MATERIAL DECLARATION486 BGA (6X8 MM) (BZ48) CML SnAgCu Au Wire Low Alpha mold compound

Last Updated: 
Feb 05, 2018
Version: 
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IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements.  The composition table were based from the Material Declaration Datasheet of the materials use on the product.