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IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_CML_SnAgCu_CuPd WIRE_ATB120 Film_GR9810 Mold Compound | Cypress Semiconductor

IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_CML_SnAgCu_CuPd WIRE_ATB120 Film_GR9810 Mold Compound

Last Updated: 
Feb 06, 2018
Version: 
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IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.