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AN69061 - Design, Manufacturing, and Handling Guidelines for Cypress Wafer Level Chip Scale Packages | Cypress Semiconductor

AN69061 - Design, Manufacturing, and Handling Guidelines for Cypress Wafer Level Chip Scale Packages

Last Updated: 
Apr 27, 2017
Version: 
*E
AN69061 provides guidelines for the design, manufacture, and handling of Cypress wafer level chip scale packages on flexible printed circuits and rigid printed circuit boards.

Introduction

This application note is for engineers who design and develop surface mount technology (SMT), printed circuit boards (PCB), or flexible printed circuits (FPC) for wafer level chip-scale package (WLCSP) devices.