You are here

AN17006 - High Speed Serial Simulation with HOTLink II™ | Cypress Semiconductor

AN17006 - High Speed Serial Simulation with HOTLink II™

Last Updated: 
Jul 20, 2017
Version: 
*C
AN17006 discusses the methodology for simulation of high speed links of the HOTLink II™ over the backplanes, using H-Spice.

HOTLink II™ Background

 
The HOTLink II™ family of devices are point-to-point or point-to-multipoint communication building blocks, providing encoding, serialization, deserialization, and decoding at high speed and are compatible with many communication standards. A HOTLink II device is a frequency agile transceiver with the ability of the serial links to transport data at a rate between 0.2 and 1.5 Gigabits per second (Gbps) per channel.