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AN17006 - High Speed Serial Simulation with HOTLink II™

Last Updated: 03/22/2011
Version: *A

AN17006 discusses the methodology for simulation of high speed links of the HOTLink II™ over the backplanes, using H-Spice.

The HOTLink II™ family of devices are point-to-point or point-to-multipoint communication building blocks, providing encoding, serialization, deserialization, and decoding at high speed and are compatible with many communication standards. A HOTLink II device is a frequency agile transceiver with the ability of the serial links to transport data at a rate between 0.2 and 1.5 Gigabits per second (Gbps) per channel.

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Spec No: 001-17006; Sunset Owner: SAAC; Secondary Owner: CGX; Sunset Date: 09/23/11

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