CYWB0226ABSX-FDXIT
| Product Obsolescence Date |
12/31/2012 |
| Order Close Date |
07/03/2013 |
| Last Time Ship Date |
01/01/2014 |
| Closest Alternative |
CYWB0226ABS-BVXI
|
| Development Kit |
CYWBDVK002AB
|
| Automotive Qualified |
N |
| Interfaces Supported |
HS-USB, SD/MMC+ |
| Clock Input Frequency (MHz) |
19.2, 26 |
| Max. Operating Voltage (V) |
3.30 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| Min. Operating Voltage (V) |
1.80 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$13.50 |
$11.10 |
$9.00 |
$8.40 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
WLCSP |
| No. of Pins |
81 |
| Package Dimensions |
154 L X 21.65 H X 154 W (Mils) |
| Package Weight |
15.73 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
REEL
|
| Package Carrier Drawing / Orientation |
Tape Drawing, Reel Drawing,
Package Orientation |
| Standard Pack Quantity |
2000 |
| Minimum Order Quantity (MOQ) |
2000 |
| Order Increment |
2000 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.31.0000
|
| ECCN |
3A991
|
| ECCN Suball |
(A.3)
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
1 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Sn/Ag/Cu |
| Marking |
Cypress Marking Format |
Package Material Declaration
81L - FN81B WLCSP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/09/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - WLCSP (FN20A, 49, 81A, 81B) , SAC396 - AMKOR TAIWAN ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - WLCSP (FN49, 81A, 81B) , SAC396 - JCAP CHINA ASSEMBLY
Last Update: 07/03/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Package Qualification Report
103604 - 81-Ball Wafer Level Chip Scale Package (WLCSP), MSL1, 260C, JCAP - JC.pdf
Last Update: 04/17/2013
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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|
Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
|
Product Termination Notice (PTN) (1)
PTN125183
Last Update: 11/01/2013
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