CYWB0124AB-BVXI
| Development Kit |
CYWBDVK001AB
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| Automotive Qualified |
N |
| Interfaces Supported |
HS-USB, SD/MMC+, SLC NAND |
| Clock Input Frequency (MHz) |
19.2, 24, 26, 48 |
| Max. Operating Voltage (V) |
3.30 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| Min. Operating Voltage (V) |
1.80 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$15.70 |
$12.80 |
$10.60 |
$10.50 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
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* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
BGA |
| No. of Pins |
100 |
| Package Dimensions |
236 L X 1 H X 236 W (Mils) |
| Package Weight |
72.92 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
429 |
| Minimum Order Quantity (MOQ) |
429 |
| Order Increment |
429 |
| Estimated Lead Time (days) |
91 |
| HTS Code |
8542.31.0000
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| ECCN |
3A991
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| ECCN Suball |
(A.3)
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Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
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| PB Free |
Y |
| Lead/Ball Finish |
Sn/Ag/Cu |
| Marking |
Cypress Marking Format |
Package Material Declaration
100-VFBGA 6X6X1.0MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/06/2012
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IPC 1752 Material Declaration
IPC-1752-2_V1.1_VFBGA100 (6X6X1.0MM)_NON GREEN SUBSTRATE_ASE
Last Update: 07/04/2012
IPC-1752-2_V1.1_VFBGA100 (6X6X1.0MM)_CML
Last Update: 07/04/2012
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RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BZ 36,48,52,56,100) USING MOLD COMPOUND KE-G2270, ADHESIVE 2025D, SAC105 - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
ROHS ANALYSIS REPORT BGA (BK48A,BK48B,BK48C,BZ36,BZ48A,BZ48B,BZ54C,BZ56,BZ100) USING MOLD COMPOUND KEG2270, ADHESIVE QMI506, SAC105 - CML ASSEMBLY
Last Update: 07/04/2012
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Technical Documents
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Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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