CYWB0120AB-BVXI
| Product Obsolescence Date |
12/31/2012 |
| Order Close Date |
07/03/2013 |
| Last Time Ship Date |
01/01/2014 |
| Closest Alternative |
CYWB0124AB-BVXI
|
| Development Kit |
CYWBDVK001AB
|
| Automotive Qualified |
N |
| Interfaces Supported |
HS-USB, SD/MMC+ |
| Clock Input Frequency (MHz) |
19.2, 24, 26, 48 |
| Max. Operating Voltage (V) |
3.30 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| Min. Operating Voltage (V) |
1.80 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$9.00 |
$7.40 |
$6.00 |
$5.60 |
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
BGA |
| No. of Pins |
100 |
| Package Dimensions |
236 L X 1 H X 236 W (Mils) |
| Package Weight |
72.92 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
429 |
| Minimum Order Quantity (MOQ) |
429 |
| Order Increment |
429 |
| Estimated Lead Time (days) |
91 |
| HTS Code |
8542.31.0000
|
| ECCN |
3A991
|
| ECCN Suball |
(A.3)
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Sn/Ag/Cu |
| Marking |
Cypress Marking Format |
Package Material Declaration
100-VFBGA 6X6X1.0MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/06/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_VFBGA100 (6X6X1.0MM)_NON GREEN SUBSTRATE_ASE
Last Update: 07/04/2012
IPC-1752-2_V1.1_VFBGA100 (6X6X1.0MM)_CML
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BZ 36,48,52,56,100) USING MOLD COMPOUND KE-G2270, ADHESIVE 2025D, SAC105 - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
ROHS ANALYSIS REPORT BGA (BK48A,BK48B,BK48C,BZ36,BZ48A,BZ48B,BZ54C,BZ56,BZ100) USING MOLD COMPOUND KEG2270, ADHESIVE QMI506, SAC105 - CML ASSEMBLY
Last Update: 07/04/2012
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
|
|
Product Change Notice (PCN) (1)
PCN125145
Last Update: 07/06/2012
|
Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
|
Product Termination Notice (PTN) (1)
PTN125183
Last Update: 11/01/2013
|
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