CYV15G0101DXB-BBXC
| Automotive Qualified |
N |
| Functions |
SERDES |
| Standard |
SMPTE / DVBASI |
| Min. Operating Voltage (V) |
3.15 |
| 8B / 10B ENDEC |
Y |
| Min. Operating Temp. (°C) |
0 |
| Max. Operating Temp. (°C) |
70 |
| Max. Speed (Mbps) |
1500 |
| No. of Channels |
1 |
| Min. Speed (Mbps) |
143 |
| Max. Operating Voltage (V) |
3.45 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$36.04 |
$33.01 |
$29.99 |
$27.47 |
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
BGA |
| No. of Pins |
100 |
| Package Dimensions |
435 L X 1.4 H X 435 W (Mils) |
| Package Weight |
266.60 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
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| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
176 |
| Minimum Order Quantity (MOQ) |
176 |
| Order Increment |
176 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.39.0000
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| ECCN |
5A991
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| ECCN Suball |
B.1
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Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
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| PB Free |
Y |
| Lead/Ball Finish |
Sn/Ag/Cu |
| Marking |
Cypress Marking Format |
Package Material Declaration
100-BGA 11X11mm 001-04906
Last Update: 07/16/2012
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RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BK/BP 36, 42, 48, 96) (BW 96,100,119,144,165,172,196,209,256,400) USING MOLD COMPOUND KEG2270, ADHESIVE 2025D, SAC405 - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
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Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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