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CYDMX256A16-90BVXI Status: In Production Alert me about changes
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Quality and RoHS Technical Documents Related Products
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Datasheet

CYDMX256A16, CYDMX256B16, CYDMX128A16, CYDMX128B16 ,CYDMX064A16, CYDMX064B16: 16 K/8 K/4 K × 16 MoBL® ADM Asynchronous Dual-Port Static RAM (PDF, 0.30 MB)
Datasheet updated: 12/19/2011

CYDMX256A16-90BVXI

Automotive Qualified N
Type Asynchronous
Min. Operating Voltage (V) 1.80
Max. Operating Voltage (V) 3.30
Depth (K) 16
Max. Operating Temp. (°C) 85
Speed (ns) 90
Density (Kb) 256
Interface Type SRAM and ADMux
Bus Width (bits) 16
Min. Operating Temp. (°C) -40

Pricing & Inventory Availability

1-10 unit Price*
11-100 unit Price*
101-1000 unit Price*
1001 + unit Price*
$9.35
$7.78
$6.89
$6.83

Availability
Quantity
Ships In
Order Now
In Stock 5 24-48 hours Check Distributors

* Prices are shown in United States dollars and are for budgetary use only.


Packaging/Ordering

Package BGA
No. of Pins 100
Package Dimensions 236 L X 1 H X 236 W (Mils)
Package Weight 72.92 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Drawing, Package Orientation
Standard Pack Quantity 429
Minimum Order Quantity (MOQ) 429
Order Increment 429
Estimated Lead Time (days) 42
HTS Code 8542.32.0040
ECCN EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Sn/Ag/Cu
Marking Cypress Marking Format
Package Material Declaration
100-VFBGA 6X6X1.0MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Last Update: 07/06/2012
IPC 1752 Material Declaration
IPC-1752-2_V1.1_VFBGA100 (6X6X1.0MM)_NON GREEN SUBSTRATE_ASE Last Update: 07/04/2012
IPC-1752-2_V1.1_VFBGA100 (6X6X1.0MM)_CML Last Update: 07/04/2012
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BZ 36,48,52,56,100) USING MOLD COMPOUND KE-G2270, ADHESIVE 2025D, SAC105 - ASE TAIWAN ASSEMBLY Last Update: 07/04/2012
ROHS ANALYSIS REPORT BGA (BK48A,BK48B,BK48C,BZ36,BZ48A,BZ48B,BZ54C,BZ56,BZ100) USING MOLD COMPOUND KEG2270, ADHESIVE QMI506, SAC105 - CML ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

Product Change Notice (PCN) (2)
PCN125145 Last Update: 07/06/2012
PCN071464 Last Update: 17/07/2008
Product Information Notice (PIN) (1)
PCN125157 Last Update: 19/06/2012

Related Products

CYDMX256A16-65BVXI


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