CY8CPLC10-28PVXIT
| Development Kit |
CY3272, CY3273
|
| Flash (KB) |
N/A |
| CPU Core |
M8C |
| Automotive Qualified |
N |
| Min. Operating Voltage (V) |
4.75 |
| Max. Operating Voltage (V) |
5.25 |
| Max Baud Rate (bps) |
2400 |
| Max. Operating Temp. (°C) |
85 |
| No. of GPIOs |
N/A |
| No. of Programmable Digital Blocks |
N/A |
| PLC Type |
Fixed-Function |
| SRAM (Bytes) |
N/A |
| Min. Operating Temp. (°C) |
-40 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$6.68 |
$6.12 |
$5.56 |
$5.09 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
SSOP |
| No. of Pins |
28 |
| Package Dimensions |
408 L X 0 H X 210 W (Mils) |
| Package Weight |
229.90 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
REEL
|
| Package Carrier Drawing / Orientation |
Tape Drawing, Reel Drawing,
Package Orientation |
| Standard Pack Quantity |
1000 |
| Minimum Order Quantity (MOQ) |
1000 |
| Order Increment |
1000 |
| Estimated Lead Time (days) |
91 |
| HTS Code |
8542.31.0000
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au, Pure Sn |
| Marking |
Cypress Marking Format |
Package Material Declaration
28L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD)
Last Update: 07/16/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_SSOP 28_CML_NIPDAU
Last Update: 07/05/2012
IPC-1752-2_V1.1_SSOP 28_OSET_PURE SN
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP 20, 28) USING MOLD COMPOUND CEL9220HF, ADHESIVE 8340, PURE SN - OSE TAIWAN ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP20,28,48,56) QSOP (SQ20,24) SOIC (SZ18,24) TSOP (ZT32) USING MOLD COMPOUND KEG3000DA, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY
Last Update: 07/04/2012
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Change Notice (PCN) (1)
PCN125156
Last Update: 18/06/2012
|
Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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