CY8CLED03G01-56LTXI
| Development Kit |
CY3276, CY3277
|
| Flash (KB) |
16 |
| CPU Core |
M8C |
| Max. Operating Frequency (MHz) |
2 |
| Automotive Qualified |
N |
| CapSense |
Y |
| SRAM (Bytes) |
1024 |
| Max. Operating Voltage (V) |
32.00 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| No. of GPIOs |
10 |
| No. of Programmable Digital Blocks |
8 |
| Min. Operating Voltage (V) |
7.00 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$6.94 |
$6.35 |
$5.77 |
$5.29 |
Availability |
Quantity |
Ships In |
Order Now |
| In Stock |
15 |
24-48 hours |
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
QFN |
| No. of Pins |
56 |
| Package Dimensions |
315 L X 1 H X 315 W (Mils) |
| Package Weight |
174.17 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
260 |
| Minimum Order Quantity (MOQ) |
260 |
| Order Increment |
260 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.31.0000
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au |
| Marking |
Cypress Marking Format |
Package Material Declaration
056L-QFN 001-04327
Last Update: 07/16/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1A_QFN56_8X8MM_AMKOR-ANAM PHIL_LT
Last Update: 07/05/2012
IPC-1752-2_V1.1A_QFN56_8X8MM_ASE-SHANGHAI_LT
Last Update: 07/04/2012
IPC-1752-2_V1.1A_QFN56_8X8MM_ASE-TAIWAN_LT
Last Update: 07/04/2012
IPC-1752-2_V1.1A_QFN56_8X8MM_CML_LT
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - QFN (LT32B,40A,48B,56,56B,68) USING MOLD COMPOUND GE7470LA, ADHESIVE QMI519, NIPDAU - CML ASSEMBLYCML
Last Update: 07/04/2012
QFN - LQ24 - 001-79754
Last Update: 06/28/2012
LT56B - 001-79781
Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LT32B,40A,56,68) USING MOLD COMPOUND G700L, ADHESIVE EN4900G, NIPDAU-AG - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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