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Datasheet

Datasheet – PSoC® 5LP CY8C58LP Programmable System-on-Chip (PDF, 7.34 MB)
Datasheet updated: 06/03/2014

CY8C5868LTI-LP039

Development Kit CY8CKIT-050
No. of Dedicated Digital Filter Blocks 1
CapSense Y
Flash (KB) 256
CPU Core ARM Cortex-M3
Max. Operating Frequency (MHz) 67
Dedicated ADC (#_ Max Resolution @ Sample Rate) DelSig (1, 20-bit @ 180 sps), SAR (2, 12-bit @ 1000 ksps)
Dedicated DAC (#_ Max Resolution @ Sample Rate) (4, 8-bit @ 8 msps)
LCD Direct Drive (Yes/No) Y
Min. Operating Voltage (V) 1.71
Max. Operating Voltage (V) 5.50
Min. Operating Temp. (°C) -40
Max. Operating Temp. (°C) 85
No. of Dedicated Comparators 4
No. of GPIOs 38
SRAM (KB) 64
No. of Programmable Universal Digital Blocks 24
No. of Dedicated Timer/Counter/PWM Blocks 4
No. of CAN Controllers 1
Automotive Qualified N

Pricing & Inventory Availability

1-9
unit Price*
10-24
unit Price*
25-99
unit Price*
100-249
unit Price*
250-999
unit Price*
1000 +
unit Price*
$13.14
$12.59
$12.04
$11.49
$10.94
$10.02

Availability
Quantity
Ships In
Order Now
In Stock 838 24-48 hours

* Prices are shown in United States dollars and are for budgetary use only for volume of 1ku


Packaging/Ordering

Package QFN
No. of Pins 68
Package Dimensions 315 L X 35 H X 315 W (Mils)
Package Weight 177.81 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Drawing, Package Orientation
Standard Pack Quantity 260
Minimum Order Quantity (MOQ) 260
Order Increment 260
Estimated Lead Time (days) 35
HTS Code 8542.31.0000
ECCN 3A991
ECCN Suball (A.3)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Ni/Pd/Au
Marking Cypress Marking Format
Package Material Declaration
68L - QFN 8X8X1.0MM (SAW VERSION) Last Update: 11/10/2014
IPC 1752 Material Declaration
QFN 68 - 001-80626 Last Update: 08/29/2012
QFN 68 - 001-80628 Last Update: 08/29/2012
RoHS Analysis Certificates (CoA)
LT56B - 001-79781 Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LT32B,40A,56,68) USING MOLD COMPOUND G700L, ADHESIVE EN4900G, NIPDAU-AG - ASE TAIWAN ASSEMBLY Last Update: 07/04/2012
LT32 - 001-79788 Last Update: 06/28/2012
Package Qualification Report
001-70192_0C_V.pdf Last Update: 07/23/2014
QTP 114407_ 68-Lead Saw QFN (Quad Flat No-Lead), (8 x 8 x 1.0mm) , NiPdAu, MSL3, 260C Reflow, CML-RA.pdf Last Update: 04/25/2012
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
001-85637_0F_V.pdf Last Update: 04/25/2014


Technical Documents

Product Change Notice (PCN) (1)
PCN145265 Last Update: 18/03/2014
Product Information Notice (PIN) (4)
PIN145296 Last Update: 16/05/2014
PIN145277 Last Update: 19/03/2014
PIN145273 Last Update: 18/03/2014
PIN135200 Last Update: 21/03/2013
Boundary Scan BSDL (4)
CY8C58LPXXX_QFN68_5JTAG - BSDL Last Update: 19/12/2013
CY8C58LPXXX_QFN68_4JTAG - BSDL Last Update: 19/12/2013
CY8C58LPXXX_QFN68_USB_5JTAG - BSDL Last Update: 19/12/2013
CY8C58LPXXX_QFN68_USB_4JTAG - BSDL Last Update: 19/12/2013



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