CY8C24094-24BVXIT
| Product Obsolescence Date |
12/31/2012 |
| Order Close Date |
07/03/2013 |
| Last Time Ship Date |
01/01/2014 |
| Development Kit |
CY3214-PSoCEvalUSB
|
| Flash (KB) |
16 |
| PWMs |
HW |
| Automotive Qualified |
N |
| Min. Operating Voltage (V) |
3.00 |
| Max. Operating Voltage (V) |
5.25 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| No. of GPIOs |
56 |
| No. of Programmable Digital Blocks |
0 |
| SRAM (KB) |
1 |
| No. of CapSense IO |
44 |
| Proximity Sensing |
Y |
| Sliders |
8 |
| SmartSense Enabled |
N |
| Comm. Interface |
I2C, SPI, UART, USB |
| CPU Core |
M8C |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$15.40 |
$14.10 |
$12.50 |
$11.00 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
VFBGA |
| No. of Pins |
100 |
| Package Dimensions |
236 L X 1 H X 236 W (Mils) |
| Package Weight |
72.92 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
REEL
|
| Package Carrier Drawing / Orientation |
Tape Drawing, Reel Drawing,
Package Orientation |
| Standard Pack Quantity |
2000 |
| Minimum Order Quantity (MOQ) |
2000 |
| Order Increment |
2000 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.31.0000
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Sn/Ag/Cu |
| Marking |
Cypress Marking Format |
Package Material Declaration
100-VFBGA 6X6X1.0MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/06/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_VFBGA100 (6X6X1.0MM)_NON GREEN SUBSTRATE_ASE
Last Update: 07/04/2012
IPC-1752-2_V1.1_VFBGA100 (6X6X1.0MM)_CML
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BZ 36,48,52,56,100) USING MOLD COMPOUND KE-G2270, ADHESIVE 2025D, SAC105 - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
ROHS ANALYSIS REPORT BGA (BK48A,BK48B,BK48C,BZ36,BZ48A,BZ48B,BZ54C,BZ56,BZ100) USING MOLD COMPOUND KEG2270, ADHESIVE QMI506, SAC105 - CML ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Development Kits/Boards (1)
PSoC® 1 Kits
Last Update: 14/08/2012
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Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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Product Termination Notice (PTN) (1)
PTN125183
Last Update: 11/01/2013
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