CY8C21434 - 24LQXI - Cypress Semiconductor

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CY8C21434-24LQXI Status: In Production		Alert me about changes to this product

CY8C21434-24LQXI

Development Kit	CY3213A-DK, CY3212-32QFN
Flash (KB)	8
PWMs	HW
Automotive Qualified	N
Min. Operating Voltage (V)	2.40
Max. Operating Voltage (V)	5.25
Min. Operating Temp. (°C)	-40
Max. Operating Temp. (°C)	85
No. of GPIOs	28
No. of Programmable Digital Blocks	3
SRAM (KB)	0.5
No. of CapSense IO	24
Proximity Sensing	Y
Sliders	4
SmartSense Enabled	N
Comm. Interface	I2C, SPI, UART
CPU Core	M8C

1-10 unit Price*	11-100 unit Price*	101-1000 unit Price*	1001 + unit Price*
$3.06	$2.81	$2.49	$2.19

Availability	Quantity	Ships In	Order Now
In Stock	82	24-48 hours

* Prices are shown in United States dollars and are for budgetary use only.

Package	QFN
No. of Pins	32
Package Dimensions	196 L X 0.6 H X 196 W (Mils)
Package Weight	43.24 (mgs)
Package Cross Section Drawing	Download
Package Carrier	TRAY
Package Carrier Drawing / Orientation	Drawing, Package Orientation
Standard Pack Quantity	490
Minimum Order Quantity (MOQ)	490
Order Increment	490
Estimated Lead Time (days)	42
HTS Code	8542.31.0000
ECCN	EAR99

Moisture Sensitivity Level (MSL)	3
Peak Reflow Temp. (°C)	260 (Cypress Reflow Profile)
RoHS Compliant	Y Print RoHS Certificate of Compliance
PB Free	Y
Lead/Ball Finish	Ni/Pd/Au
Marking	Cypress Marking Format
Package Material Declaration 32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 07/06/2012
RoHS Analysis Certificates (CoA) PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012 QFN - LQ24 - 001-79754 Last Update: 06/28/2012 LT56B - 001-79781 Last Update: 06/28/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials Please click here
Package Qualification Report 001-61138_00_V.pdf Last Update: 07/13/2012 001-70191_0A_V.pdf Last Update: 03/12/2012
Device Qualification Reports FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.

Development Kits/Boards (9)
General PSoC Programming Last Update: 06/02/2013
CY3215-DK In-Circuit Emulation Development Kit Last Update: 05/02/2013
CY3210-ProtoMod (OBSOLETE) Last Update: 19/10/2012
PSoC® 1 Kits Last Update: 14/08/2012
CY3210-ExpressDK Last Update: 23/04/2012
CY3280-BBM Universal CapSense Prototyping Module Kit Last Update: 09/02/2012
CY3210-MiniProg1 Last Update: 08/02/2012
CY3210-FanMod Last Update: 10/06/2010
3rd-Party Development Tool: m i k r o E l e k t r o n i k a PSoC System Last Update: 14/12/2009

Software and Drivers (2)
In-System Serial Programming (ISSP) CY3207ISSP Software v1.999 Last Update: 07/02/2011
PSoC Programmer Archive Last Update: 04/12/2009

Models (1)
CY8C21x34 - IBIS Last Update: 05/04/2012

Product Change Notice (PCN) (7)
PCN125129 Last Update: 07/06/2012
PCN115072 Last Update: 19/07/2011
PCN094861 Last Update: 22/11/2010
PCN094816 Last Update: 23/07/2010
PCN094815 Last Update: 23/07/2010
PCN094808 Last Update: 05/07/2010
PCN104882 Last Update: 28/01/2010