CY8C20446H - 24LQXIT - Cypress Semiconductor

Home > Products > CapSense® Controllers > CapSense > SmartSense™ > CY8C20446H-24LQXIT

CY8C20446H-24LQXIT Status: Not Recommended for New Designs		Alert me about changes to this product

CY8C20446H-24LQXIT

Product Obsolescence Date	12/31/2012
Order Close Date	07/03/2013
Last Time Ship Date	01/01/2014
Closest Alternative	CY8C20446A-24LQXIT
Development Kit	CY3280-20X66H
Flash (KB)	16
PWMs	SW
Automotive Qualified	N
Min. Operating Voltage (V)	1.71
Max. Operating Voltage (V)	5.50
Min. Operating Temp. (°C)	-40
Max. Operating Temp. (°C)	85
No. of GPIOs	28
No. of Programmable Digital Blocks	0
SRAM (KB)	2
No. of CapSense IO	25
Proximity Sensing	N
Sliders	5
SmartSense Enabled	Y
Comm. Interface	I2C, SPI
CPU Core	M8C

1-10 unit Price*	11-100 unit Price*	101-1000 unit Price*	1001 + unit Price*
$3.13	$2.86	$2.54	$2.23

Availability	Quantity	Ships In	Order Now
Out of Stock	0	Please click here to check lead times	Check Distributors

* Prices are shown in United States dollars and are for budgetary use only.

Package	QFN
No. of Pins	28
Package Dimensions	196 L X 0.6 H X 196 W (Mils)
Package Weight	43.44 (mgs)
Package Cross Section Drawing	Download
Package Carrier	REEL
Package Carrier Drawing / Orientation	Tape Drawing, Reel Drawing, Package Orientation
Standard Pack Quantity	2500
Minimum Order Quantity (MOQ)	2500
Order Increment	2500
Estimated Lead Time (days)	42
HTS Code	8542.31.0000
ECCN	EAR99

Moisture Sensitivity Level (MSL)	3
Peak Reflow Temp. (°C)	260 (Cypress Reflow Profile)
RoHS Compliant	Y Print RoHS Certificate of Compliance
PB Free	Y
Lead/Ball Finish	Ni/Pd/Au
Marking	Cypress Marking Format
Package Material Declaration 32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 07/06/2012
IPC 1752 Material Declaration IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_AMKOR-PHIL_LQ Last Update: 07/04/2012 IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CARSEM_LQ Last Update: 07/04/2012 IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CML_LQ Last Update: 07/04/2012 QFN 32 - 001-80519 Last Update: 08/29/2012
RoHS Analysis Certificates (CoA) PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012 QFN - LQ24 - 001-79754 Last Update: 06/28/2012 LT56B - 001-79781 Last Update: 06/28/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials Please click here
Package Qualification Report 001-61138_00_V.pdf Last Update: 07/13/2012 001-70191_0A_V.pdf Last Update: 03/12/2012
Device Qualification Reports FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.