CY8C20446H - 24LQXI - Cypress Semiconductor

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CY8C20446H-24LQXI Status: Not Recommended for New Designs		Alert me about changes to this product

CY8C20446H-24LQXI

Product Obsolescence Date	12/31/2012
Order Close Date	07/03/2013
Last Time Ship Date	01/01/2014
Closest Alternative	CY8C20446A-24LQXI
Development Kit	CY3280-20X66H
Flash (KB)	16
PWMs	SW
Automotive Qualified	N
Min. Operating Voltage (V)	1.71
Max. Operating Voltage (V)	5.50
Min. Operating Temp. (°C)	-40
Max. Operating Temp. (°C)	85
No. of GPIOs	28
No. of Programmable Digital Blocks	0
SRAM (KB)	2
No. of CapSense IO	25
Proximity Sensing	N
Sliders	5
SmartSense Enabled	Y
Comm. Interface	I2C, SPI
CPU Core	M8C

1-10 unit Price*	11-100 unit Price*	101-1000 unit Price*	1001 + unit Price*
$3.05	$2.79	$2.48	$2.18

Availability	Quantity	Ships In	Order Now
In Stock	15	24-48 hours	Check Distributors

* Prices are shown in United States dollars and are for budgetary use only.

Package	QFN
No. of Pins	28
Package Dimensions	196 L X 0.6 H X 196 W (Mils)
Package Weight	43.44 (mgs)
Package Cross Section Drawing	Download
Package Carrier	TRAY
Package Carrier Drawing / Orientation	Drawing, Package Orientation
Standard Pack Quantity	490
Minimum Order Quantity (MOQ)	490
Order Increment	490
Estimated Lead Time (days)	42
HTS Code	8542.31.0000
ECCN	EAR99

Moisture Sensitivity Level (MSL)	3
Peak Reflow Temp. (°C)	260 (Cypress Reflow Profile)
RoHS Compliant	Y Print RoHS Certificate of Compliance
PB Free	Y
Lead/Ball Finish	Ni/Pd/Au
Marking	Cypress Marking Format
Package Material Declaration 32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 07/06/2012
IPC 1752 Material Declaration IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_AMKOR-PHIL_LQ Last Update: 07/04/2012 IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CARSEM_LQ Last Update: 07/04/2012 IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CML_LQ Last Update: 07/04/2012 QFN 32 - 001-80519 Last Update: 08/29/2012
RoHS Analysis Certificates (CoA) PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012 QFN - LQ24 - 001-79754 Last Update: 06/28/2012 LT56B - 001-79781 Last Update: 06/28/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials Please click here
Package Qualification Report 001-61138_00_V.pdf Last Update: 07/13/2012 001-70191_0A_V.pdf Last Update: 03/12/2012
Device Qualification Reports FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.