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CY8C20437-24LQXI Status: In Production Alert me about changes
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Datasheet

CY8C20xx7/S: 1.8 V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders, Proximity Sensors (PDF, 0.66 MB)
Datasheet updated: 02/08/2013

CY8C20437-24LQXI

Development Kit CY3280-20xx7
Flash (KB) 8
PWMs SW
Automotive Qualified N
Min. Operating Voltage (V) 1.71
Max. Operating Voltage (V) 5.50
Min. Operating Temp. (°C) -40
Max. Operating Temp. (°C) 85
No. of GPIOs 29
No. of Programmable Digital Blocks 0
SRAM (KB) 1
No. of CapSense IO 27
Proximity Sensing Y
Sliders 5
SmartSense Enabled N
Comm. Interface I2C, SPI
CPU Core M8C

Pricing & Inventory Availability

1-10 unit Price*
11-100 unit Price*
101-1000 unit Price*
1001 + unit Price*
$2.49
$2.28
$2.03
$1.78

Availability
Quantity
Ships In
Order Now
In Stock 130 24-48 hours

* Prices are shown in United States dollars and are for budgetary use only.


Packaging/Ordering

Package QFN
No. of Pins 32
Package Dimensions 196 L X 0.6 H X 196 W (Mils)
Package Weight 43.44 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Drawing, Package Orientation
Standard Pack Quantity 490
Minimum Order Quantity (MOQ) 490
Order Increment 490
Estimated Lead Time (days) 42
HTS Code 8542.31.0000
ECCN EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Ni/Pd/Au
Marking Cypress Marking Format
Package Material Declaration
32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 07/06/2012
IPC 1752 Material Declaration
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_AMKOR-PHIL_LQ Last Update: 07/04/2012
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CARSEM_LQ Last Update: 07/04/2012
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CML_LQ Last Update: 07/04/2012
QFN 32 - 001-80519 Last Update: 08/29/2012
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012
QFN - LQ24 - 001-79754 Last Update: 06/28/2012
LT56B - 001-79781 Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
001-61138_00_V.pdf Last Update: 07/13/2012
001-70191_0A_V.pdf Last Update: 03/12/2012
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

Development Kits/Boards (1)
PSoC® 1 Kits Last Update: 14/08/2012
Models (1)
CY8C20xx7 - IBIS Last Update: 07/11/2012
Product Change Notice (PCN) (0)


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