CY8C20334 - 12LQXIT - Cypress Semiconductor

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CY8C20334-12LQXIT Status: In Production		Alert me about changes to this product

CY8C20334-12LQXIT

Development Kit	CY3203A-DK
Flash (KB)	8
PWMs	SW
Automotive Qualified	N
Min. Operating Voltage (V)	2.40
Max. Operating Voltage (V)	5.25
Min. Operating Temp. (°C)	-40
Max. Operating Temp. (°C)	85
No. of GPIOs	20
No. of Programmable Digital Blocks	0
SRAM (KB)	0.5
No. of CapSense IO	17
Proximity Sensing	N
Sliders	3
SmartSense Enabled	N
Comm. Interface	I2C, SPI
CPU Core	M8C

1-10 unit Price*	11-100 unit Price*	101-1000 unit Price*	1001 + unit Price*
$1.93	$1.76	$1.56	$1.38

Availability	Quantity	Ships In	Order Now
Out of Stock	0	Please click here to check lead times	Check Distributors

* Prices are shown in United States dollars and are for budgetary use only.

Package	QFN
No. of Pins	24
Package Dimensions	157.5 L X 23.6 H X 157.5 W (Mils)
Package Weight	31.33 (mgs)
Package Cross Section Drawing	Download
Package Carrier	REEL
Package Carrier Drawing / Orientation	Tape Drawing, Reel Drawing, Package Orientation
Standard Pack Quantity	2500
Minimum Order Quantity (MOQ)	2500
Order Increment	2500
Estimated Lead Time (days)	42
HTS Code	8542.31.0000
ECCN	EAR99

Moisture Sensitivity Level (MSL)	3
Peak Reflow Temp. (°C)	260 (Cypress Reflow Profile)
RoHS Compliant	Y Print RoHS Certificate of Compliance
PB Free	Y
Lead/Ball Finish	Ni/Pd/Au
Marking	Cypress Marking Format
Package Material Declaration 24L - QFN 4.0 X 4.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 07/05/2012
IPC 1752 Material Declaration IPC-1752-2_V1.1A_QFN24 _CARSEM_4X4MM_LQ Last Update: 07/03/2012 IPC-1752-2_V1.1A_QFN24_AIT_4X4MM_LQ Last Update: 07/05/2012 IPC-1752-2_V1.1A_QFN24_AMKOR-PHIL_4X4MM_LQ Last Update: 07/03/2012
RoHS Analysis Certificates (CoA) PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32) (LT56,68) USING MOLD COMPOUND G770, ADHESIVE CRM1064L, NIPDAU - UNISEM ASSEMBLY Last Update: 07/04/2012 QFN - LQ24 - 001-79754 Last Update: 06/28/2012 LT56B - 001-79781 Last Update: 06/28/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials Please click here
Package Qualification Report 001-70532_0A_V.pdf Last Update: 03/12/2012
Device Qualification Reports FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.

Application Notes (1)
AN2397 - CapSense® Data Viewing Tools Last Update: 07/11/2012

Technical Reference Manuals (1)
PSoC® CY8C20x24, CY8C20x34 Technical Reference Manual (TRM) Last Update: 12/12/2011

Development Kits/Boards (1)
CY3280-BBM Universal CapSense Prototyping Module Kit Last Update: 09/02/2012

Software and Drivers (2)
In-System Serial Programming (ISSP) CY3207ISSP Software v1.999 Last Update: 07/02/2011
PSoC Programmer Archive Last Update: 04/12/2009

Models (1)
CY8C20x34 - IBIS Last Update: 05/04/2012

Product Change Notice (PCN) (7)
PCN125129 Last Update: 07/06/2012
PCN115072 Last Update: 19/07/2011
PCN094861 Last Update: 22/11/2010
PCN104914 Last Update: 22/04/2010
PCN094775 Last Update: 15/03/2010
PCN094837 Last Update: 14/10/2009
PCN084686 Last Update: 12/08/2008