CY8C20334 - 12LQXI - Cypress Semiconductor

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CY8C20334-12LQXI Status: In Production		Alert me about changes to this product

CY8C20334-12LQXI

Development Kit	CY3203A-DK
Flash (KB)	8
PWMs	SW
Automotive Qualified	N
Min. Operating Voltage (V)	2.40
Max. Operating Voltage (V)	5.25
Min. Operating Temp. (°C)	-40
Max. Operating Temp. (°C)	85
No. of GPIOs	20
No. of Programmable Digital Blocks	0
SRAM (KB)	0.5
No. of CapSense IO	17
Proximity Sensing	N
Sliders	3
SmartSense Enabled	N
Comm. Interface	I2C, SPI
CPU Core	M8C

1-10 unit Price*	11-100 unit Price*	101-1000 unit Price*	1001 + unit Price*
$1.85	$1.69	$1.50	$1.32

Availability	Quantity	Ships In	Order Now
Out of Stock	0	Please click here to check lead times

* Prices are shown in United States dollars and are for budgetary use only.

Package	QFN
No. of Pins	24
Package Dimensions	157.5 L X 23.6 H X 157.5 W (Mils)
Package Weight	31.33 (mgs)
Package Cross Section Drawing	Download
Package Carrier	TRAY
Package Carrier Drawing / Orientation	Drawing, Package Orientation
Standard Pack Quantity	490
Minimum Order Quantity (MOQ)	490
Order Increment	490
Estimated Lead Time (days)	42
HTS Code	8542.31.0000
ECCN	EAR99

Moisture Sensitivity Level (MSL)	3
Peak Reflow Temp. (°C)	260 (Cypress Reflow Profile)
RoHS Compliant	Y Print RoHS Certificate of Compliance
PB Free	Y
Lead/Ball Finish	Ni/Pd/Au
Marking	Cypress Marking Format
Package Material Declaration 24L - QFN 4.0 X 4.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 07/05/2012
IPC 1752 Material Declaration IPC-1752-2_V1.1A_QFN24 _CARSEM_4X4MM_LQ Last Update: 07/03/2012 IPC-1752-2_V1.1A_QFN24_AIT_4X4MM_LQ Last Update: 07/05/2012 IPC-1752-2_V1.1A_QFN24_AMKOR-PHIL_4X4MM_LQ Last Update: 07/03/2012
RoHS Analysis Certificates (CoA) PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32) (LT56,68) USING MOLD COMPOUND G770, ADHESIVE CRM1064L, NIPDAU - UNISEM ASSEMBLY Last Update: 07/04/2012 QFN - LQ24 - 001-79754 Last Update: 06/28/2012 LT56B - 001-79781 Last Update: 06/28/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials Please click here
Package Qualification Report 001-70532_0A_V.pdf Last Update: 03/12/2012
Device Qualification Reports FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.

Application Notes (1)
AN2397 - CapSense® Data Viewing Tools Last Update: 07/11/2012

Technical Reference Manuals (1)
PSoC® CY8C20x24, CY8C20x34 Technical Reference Manual (TRM) Last Update: 12/12/2011

Software and Drivers (2)
In-System Serial Programming (ISSP) CY3207ISSP Software v1.999 Last Update: 07/02/2011
PSoC Programmer Archive Last Update: 04/12/2009

Models (1)
CY8C20x34 - IBIS Last Update: 05/04/2012

Product Change Notice (PCN) (8)
PCN125129 Last Update: 07/06/2012
PCN115072 Last Update: 19/07/2011
PCN094861 Last Update: 22/11/2010
PCN094816 Last Update: 23/07/2010
PCN104914 Last Update: 22/04/2010
PCN094775 Last Update: 15/03/2010
PCN094837 Last Update: 14/10/2009
PCN084686 Last Update: 12/08/2008