CY8C20236A-24LKXAT
| Development Kit |
CY3215-DK
|
| Flash (KB) |
8 |
| PWMs |
SW |
| Automotive Qualified |
Y |
| Min. Operating Voltage (V) |
1.71 |
| Max. Operating Voltage (V) |
5.50 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| No. of GPIOs |
13 |
| No. of Programmable Digital Blocks |
0 |
| SRAM (KB) |
1 |
| No. of CapSense IO |
10 |
| Proximity Sensing |
N |
| Sliders |
2 |
| SmartSense Enabled |
Y |
| Comm. Interface |
I2C, SPI |
| CPU Core |
M8C |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$2.22 |
$2.03 |
$1.84 |
$1.69 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
QFN |
| No. of Pins |
16 |
| Package Dimensions |
118 L X 23 H X 118 W (Mils) |
| Package Weight |
15.57 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
REEL
|
| Package Carrier Drawing / Orientation |
Tape Drawing, Reel Drawing,
Package Orientation |
| Standard Pack Quantity |
2500 |
| Minimum Order Quantity (MOQ) |
2500 |
| Order Increment |
2500 |
| Estimated Lead Time (days) |
91 |
| HTS Code |
8542.31.0000
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au |
| Marking |
Cypress Marking Format |
Package Material Declaration
16L - QFN 3X3X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PMDD
Last Update: 07/05/2012
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IPC 1752 Material Declaration
IPC-1752-2_V1.1_QFN16_AMKOR PHIL_LG
Last Update: 07/04/2012
IPC-1752-2_V1.1_QFN16_CARSEM_LG
Last Update: 07/04/2012
IPC-1752-2_V1.1_QFN16_ASE TAIWAN_LG16A
Last Update: 07/31/2012
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RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE ATB-120A, NIPDAU-AG - AMKOR KOREA (K1) ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE NEX130C, NIPDAU-AG - AMKOR PHILS. (P3) ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLYPACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E, LG16, LQ44) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLY
Last Update: 07/03/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (16A) USING MOLD COMPOUND EMEG770H, ADHESIVE 8006NS, NIPDAU - CARSEM MALAYSIA ASSEMBLY
Last Update: 07/04/2012
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Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Development Kits/Boards (1)
PSoC® 1 Kits
Last Update: 14/08/2012
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Product Change Notice (PCN) (0)
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