CY8C20236A - 24LKXA - Cypress Semiconductor

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CY8C20236A-24LKXA Status: In Production		Alert me about changes to this product

CY8C20236A-24LKXA

Development Kit	CY3215-DK
LCD Direct Drive	N
PWMs	SW
CPU Core	M8C
Max. Operating Frequency (MHz)	24
Automotive Qualified	Y
CapSense	Y
Min. Operating Voltage (V)	1.71
Max. Operating Voltage (V)	5.50
Min. Operating Temp. (°C)	-40
Max. Operating Temp. (°C)	85
No. of Dedicated Comparators	0
No. of GPIOs	13
No. of Programmable Digital Blocks	0
SRAM (KB)	1
No. of CapSense IO	10
Proximity Sensing	N
Sliders	2
SmartSense Enabled	Y
Comm. Interface	I2C, SPI
Flash (KB)	8

1-10 unit Price*	11-100 unit Price*	101-1000 unit Price*	1001 + unit Price*
$2.15	$1.97	$1.79	$1.64

Availability	Quantity	Ships In	Order Now
In Stock	145	24-48 hours

* Prices are shown in United States dollars and are for budgetary use only.

Package	QFN
No. of Pins	16
Package Dimensions	118 L X 23 H X 118 W (Mils)
Package Weight	15.57 (mgs)
Package Cross Section Drawing	Download
Package Carrier	TRAY
Package Carrier Drawing / Orientation	Drawing, Package Orientation
Standard Pack Quantity	490
Minimum Order Quantity (MOQ)	490
Order Increment	490
Estimated Lead Time (days)	91
HTS Code	8542.31.0000
ECCN	EAR99

Moisture Sensitivity Level (MSL)	3
Peak Reflow Temp. (°C)	260 (Cypress Reflow Profile)
RoHS Compliant	Y Print RoHS Certificate of Compliance
PB Free	Y
Lead/Ball Finish	Ni/Pd/Au
Marking	Cypress Marking Format
Package Material Declaration 16L - QFN 3X3X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PMDD Last Update: 07/05/2012
IPC 1752 Material Declaration IPC-1752-2_V1.1_QFN16_AMKOR PHIL_LG Last Update: 07/04/2012 IPC-1752-2_V1.1_QFN16_CARSEM_LG Last Update: 07/04/2012 IPC-1752-2_V1.1_QFN16_ASE TAIWAN_LG16A Last Update: 07/31/2012
RoHS Analysis Certificates (CoA) PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE ATB-120A, NIPDAU-AG - AMKOR KOREA (K1) ASSEMBLY Last Update: 07/04/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE NEX130C, NIPDAU-AG - AMKOR PHILS. (P3) ASSEMBLY Last Update: 07/04/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLYPACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E, LG16, LQ44) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLY Last Update: 07/03/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (16A) USING MOLD COMPOUND EMEG770H, ADHESIVE 8006NS, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
Device Qualification Reports FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.