CY8C20234 - 12LKXIT - Cypress Semiconductor

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CY8C20234-12LKXIT Status: In Production		Alert me about changes to this product

Datasheet

CY8C20234-12LKXIT

Development Kit	CY3203A-DK
Flash (KB)	8
PWMs	SW
Automotive Qualified	N
Min. Operating Voltage (V)	2.40
Max. Operating Voltage (V)	5.25
Min. Operating Temp. (°C)	-40
Max. Operating Temp. (°C)	85
No. of GPIOs	13
No. of Programmable Digital Blocks	0
SRAM (KB)	0.5
No. of CapSense IO	10
Proximity Sensing	N
Sliders	2
SmartSense Enabled	N
Comm. Interface	I2C, SPI
CPU Core	M8C

Pricing & Inventory Availability

1-10 unit Price*	11-100 unit Price*	101-1000 unit Price*	1001 + unit Price*
$1.66	$1.52	$1.35	$1.19

Availability	Quantity	Ships In	Order Now
Out of Stock	0	Please click here to check lead times	Check Distributors

* Prices are shown in United States dollars and are for budgetary use only.

Packaging/Ordering

Package	QFN
No. of Pins	16
Package Dimensions	118 L X 23 H X 118 W (Mils)
Package Weight	15.57 (mgs)
Package Cross Section Drawing	Download
Package Carrier	REEL
Package Carrier Drawing / Orientation	Tape Drawing, Reel Drawing, Package Orientation
Standard Pack Quantity	2500
Minimum Order Quantity (MOQ)	2500
Order Increment	2500
Estimated Lead Time (days)	42
HTS Code	8542.31.0000
ECCN	EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)	3
Peak Reflow Temp. (°C)	260 (Cypress Reflow Profile)
RoHS Compliant	Y Print RoHS Certificate of Compliance
PB Free	Y
Lead/Ball Finish	Ni/Pd/Au
Marking	Cypress Marking Format
Package Material Declaration 16L - QFN 3X3X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PMDD Last Update: 07/05/2012
IPC 1752 Material Declaration IPC-1752-2_V1.1_QFN16_AMKOR PHIL_LG Last Update: 07/04/2012 IPC-1752-2_V1.1_QFN16_CARSEM_LG Last Update: 07/04/2012 IPC-1752-2_V1.1_QFN16_ASE TAIWAN_LG16A Last Update: 07/31/2012
RoHS Analysis Certificates (CoA) PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE ATB-120A, NIPDAU-AG - AMKOR KOREA (K1) ASSEMBLY Last Update: 07/04/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE NEX130C, NIPDAU-AG - AMKOR PHILS. (P3) ASSEMBLY Last Update: 07/04/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLYPACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E, LG16, LQ44) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLY Last Update: 07/03/2012 PACKAGE ROHS ANALYSIS REPORT - QFN (16A) USING MOLD COMPOUND EMEG770H, ADHESIVE 8006NS, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials Please click here
Package Qualification Report QTP 112603 16 QFN (3x3x0.6mm) NiPdAu-Ag, MSL3, 260°C Reflow ASEK-Taiwan (G).pdf Last Update: 07/16/2012
Device Qualification Reports FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.

Technical Documents

Technical Reference Manuals (1)
PSoC® CY8C20x24, CY8C20x34 Technical Reference Manual (TRM) Last Update: 12/12/2011

Development Kits/Boards (2)
PSoC® 1 Kits Last Update: 14/08/2012
CY3280-BBM Universal CapSense Prototyping Module Kit Last Update: 09/02/2012

Software and Drivers (2)
In-System Serial Programming (ISSP) CY3207ISSP Software v1.999 Last Update: 07/02/2011
PSoC Programmer Archive Last Update: 04/12/2009

Models (1)
CY8C20x34 - IBIS Last Update: 05/04/2012

Product Change Notice (PCN) (7)
PCN125129 Last Update: 07/06/2012
PCN115072 Last Update: 19/07/2011
PCN115027 Last Update: 05/05/2011
PCN094861 Last Update: 22/11/2010
PCN104961 Last Update: 23/07/2010
PCN084686 Last Update: 12/08/2008
PCN071519 Last Update: 17/07/2008