CY8C20134-12SXI
| Development Kit |
CY3203A-DK
|
| Flash (KB) |
8 |
| PWMs |
SW |
| Automotive Qualified |
N |
| Min. Operating Voltage (V) |
2.40 |
| Max. Operating Voltage (V) |
5.25 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| No. of GPIOs |
13 |
| No. of Programmable Digital Blocks |
0 |
| SRAM (KB) |
0.5 |
| No. of CapSense IO |
8 |
| Proximity Sensing |
N |
| Sliders |
1 |
| SmartSense Enabled |
N |
| Comm. Interface |
I2C, SPI |
| CPU Core |
M8C |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$1.31 |
$1.20 |
$1.06 |
$0.94 |
Availability |
Quantity |
Ships In |
Order Now |
| In Stock |
10 |
24-48 hours |
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
SOIC |
| No. of Pins |
8 |
| Package Dimensions |
193 L X 1.46 H X 150 W (Mils) |
| Package Weight |
76.45 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TUBE
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
485 |
| Minimum Order Quantity (MOQ) |
485 |
| Order Increment |
485 |
| Estimated Lead Time (days) |
63 |
| HTS Code |
8542.31.0000
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au |
| Marking |
Cypress Marking Format |
Package Material Declaration
8L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/05/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_SOIC08_AMKOR
Last Update: 07/03/2012
IPC-1752-2_V1.1_SOIC08_CML
Last Update: 07/05/2012
IPC-1752-2_V1.1_SOIC08_OSE
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - SOIC (SZ08,16,18,20,24) USING MOLD COMPOUND MP8500, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY
Last Update: 07/03/2012
PACKAGE ROHS ANALYSIS REPORT - SOIC (SZ08, 16, 18, 20, 24, 32) SSOP (SP16, 20, 28, 48) USING MOLD COMPOUND G600, ADHESIVE 8290, PURE SN - AMKOR PHILS. ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP 20,28,48,56) SOIC (SZ08,14,16) USING MOLD COMPOUND CEL9220HF, ADHESIVE 4900G, NIPDAU - OSE TAIWAN ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Change Notice (PCN) (1)
PCN125156
Last Update: 18/06/2012
|
Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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