CY7C68013A-56BAXC
| Development Kit |
CY3684
|
| CPU Core |
Enhanced 8051 |
| Automotive Qualified |
N |
| Application |
USB High-Speed Peripherals |
| I/O Options |
8/16-bit Databus, DMA, GPIO, I2C, UART |
| Data Transfers |
Bulk, Interrupt, Isochronous |
| Memory Architecture |
RAM |
| Memory Size (KB) |
16 |
| Min. Operating Voltage (V) |
3.00 |
| Max. Operating Voltage (V) |
3.60 |
| Min. Operating Temp. (°C) |
0 |
| Max. Operating Temp. (°C) |
70 |
| No. of I/Os |
24 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$12.59 |
$10.48 |
$9.27 |
$9.20 |
Availability |
Quantity |
Ships In |
Order Now |
| In Stock |
218 |
24-48 hours |
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
VFBGA |
| No. of Pins |
56 |
| Package Dimensions |
196 L X 1 H X 196 W (Mils) |
| Package Weight |
50.90 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
490 |
| Minimum Order Quantity (MOQ) |
490 |
| Order Increment |
490 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.31.0000
|
| ECCN |
3A991
|
| ECCN Suball |
(A.3)
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Sn/Ag/Cu |
| Marking |
Cypress Marking Format |
Package Material Declaration
056-BGA 5X5MM 001-04908
Last Update: 07/16/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_BGA 56_ASE
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BZ 36,48,52,56,100) USING MOLD COMPOUND KE-G2270, ADHESIVE 2025D, SAC105 - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
ROHS ANALYSIS REPORT BGA (BK48A,BK48B,BK48C,BZ36,BZ48A,BZ48B,BZ54C,BZ56,BZ100) USING MOLD COMPOUND KEG2270, ADHESIVE QMI506, SAC105 - CML ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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