CY7C68001-56PVXCT
| CPU Core |
N/A |
| Automotive Qualified |
N |
| Application |
USB High-Speed Peripherals |
| I/O Options |
8/16-bit Databus, DMA |
| Data Transfers |
Bulk, Interrupt, Isochronous, Control |
| Memory Architecture |
N/A |
| Memory Size (KB) |
N/A |
| Min. Operating Voltage (V) |
3.00 |
| Max. Operating Voltage (V) |
3.60 |
| Min. Operating Temp. (°C) |
0 |
| Max. Operating Temp. (°C) |
70 |
| No. of I/Os |
0 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$9.08 |
$7.56 |
$6.69 |
$6.64 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
SSOP |
| No. of Pins |
56 |
| Package Dimensions |
725 L X 0 H X 295 W (Mils) |
| Package Weight |
744.68 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
REEL
|
| Package Carrier Drawing / Orientation |
Tape Drawing, Reel Drawing,
Package Orientation |
| Standard Pack Quantity |
1000 |
| Minimum Order Quantity (MOQ) |
1000 |
| Order Increment |
1000 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.39.0000
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au |
| Marking |
Cypress Marking Format |
Package Material Declaration
056L-SSOP 001-03010
Last Update: 07/16/2012
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IPC 1752 Material Declaration
IPC-1752-2_V1.1_SSOP 56_CML_NIPDAU_ GREEN MC
Last Update: 07/04/2012
IPC-1752-2_V1.1_SSOP 56_OSET_NIPDAU
Last Update: 07/04/2012
SSOP 56 - 001-80408
Last Update: 08/29/2012
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RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP48,56) QSOP (SQ20,24) USING MOLD COMPOUND KEG3000DA, ADHESIVE QMI509, NIPDAU - JCET CHINA ASSEMBLY
Last Update: 07/03/2012
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP 20,28,48,56) SOIC (SZ08,14,16) USING MOLD COMPOUND CEL9220HF, ADHESIVE 4900G, NIPDAU - OSE TAIWAN ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP20,28,48,56) QSOP (SQ20,24) SOIC (SZ18,24) TSOP (ZT32) USING MOLD COMPOUND KEG3000DA, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (3)
PCN125157
Last Update: 19/06/2012
PCN104993
Last Update: 19/10/2010
PCN084642
Last Update: 17/07/2008
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