CY7C67200-48BAXI
| Development Kit |
CY3663
|
| CPU Core |
N/A |
| Automotive Qualified |
N |
| Application |
USB Embedded Hosts |
| I/O Options |
GPIO, HPI, HSS, SPI, I2C, UART |
| Data Transfers |
Bulk, Interrupt, Isochronous |
| Memory Architecture |
ROM/RAM |
| Memory Size (KB) |
16 |
| Min. Operating Voltage (V) |
2.70 |
| Max. Operating Voltage (V) |
3.60 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| No. of I/Os |
25 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$20.25 |
$16.65 |
$13.50 |
$12.60 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
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* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
FBGA |
| No. of Pins |
48 |
| Package Dimensions |
275 L X 1.2 H X 275 W (Mils) |
| Package Weight |
103.15 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
416 |
| Minimum Order Quantity (MOQ) |
416 |
| Order Increment |
416 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.31.0000
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| ECCN |
3A991
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| ECCN Suball |
(A.3)
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Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
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| PB Free |
Y |
| Lead/Ball Finish |
Sn/Ag/Cu |
| Marking |
Cypress Marking Format |
Package Material Declaration
048-BGA 7X7mm 001-04281
Last Update: 06/25/2012
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IPC 1752 Material Declaration
IPC-1752-2_V1.1_BGA 48 (7 X 7 MM) _ASET_SNAGCU
Last Update: 07/04/2012
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RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BK/BP 36, 42, 48, 96) (BW 96,100,119,144,165,172,196,209,256,400) USING MOLD COMPOUND KEG2270, ADHESIVE 2025D, SAC405 - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
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RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
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Package Qualification Report
QTP 073205, Automotive 48 Balls FBGA (1.2mm Thickness) and 48 Balls FBGA (6 x 8 x 1mm), SnAgCu, MSL3, 260øC Reflow , ASE-Taiwan.pdf
Last Update: 04/25/2012
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Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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