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Datasheet

CY7C65211 - USB-Serial Single-Channel (UART/I2C/SPI) Bridge with CapSense® and BCD (PDF, 0.70 MB)
Datasheet updated: 06/19/2014

CY7C65211-24LTXI

CPU Core M8
Automotive Qualified N
Application Blood glucose meter, Battery-operated devices, Cables, Point-of-Service (POS) terminals, Industrial and T&M devices, Gaming devices
I/O Options I2C, 8-Bit UART, SPI, GPIO, CapSense
Data Transfers Bulk, Interrupt, Control
Memory Architecture Flash
Memory Size (KB) 32
Min. Operating Voltage (V) 1.71
Max. Operating Voltage (V) 5.50
Min. Operating Temp. (°C) -40
Max. Operating Temp. (°C) 85
No. of I/Os 14

Pricing & Inventory Availability

1-9
unit Price*
10-24
unit Price*
25-99
unit Price*
100-249
unit Price*
250-999
unit Price*
1000 +
unit Price*
$2.61
$2.26
$2.14
$1.78
$1.73
$1.61

Availability
Quantity
Ships In
Order Now
In Stock 133 24-48 hours

* Prices are shown in United States dollars and are for budgetary use only for volume of 1ku


Packaging/Ordering

Package QFN
No. of Pins 24
Package Dimensions 157.5 L X 23.6 H X 157.5 W (Mils)
Package Weight 31.33 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Drawing, Package Orientation
Standard Pack Quantity 490
Minimum Order Quantity (MOQ) 490
Order Increment 490
Estimated Lead Time (days) 28
HTS Code 8542.31.0000
ECCN 3A991
ECCN Suball (A.3)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Ni/Pd/Au
Marking Cypress Marking Format
Package Material Declaration
24L - QFN 4.0 X 4.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 06/06/2014
IPC 1752 Material Declaration
IPC-1752-2_V1.1A_QFN24 _CARSEM_4X4MM_LQ Last Update: 06/19/2014
IPC-1752-2_V1.1A_QFN24_AIT_4X4MM_LQ Last Update: 06/19/2014
IPC-1752-2_V1.1A_QFN24_AMKOR-PHIL_4X4MM_LQ Last Update: 06/19/2014
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32) (LT56,68) USING MOLD COMPOUND G770, ADHESIVE CRM1064L, NIPDAU - UNISEM ASSEMBLY Last Update: 07/04/2012
QFN - LQ24 - 001-79754 Last Update: 06/28/2012
LT56B - 001-79781 Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
001-87621_0A_V.pdf Last Update: 06/06/2014


Technical Documents

Application Notes (0)
Product Information Notice (PIN) (2)
PIN145277 Last Update: 19/03/2014
PIN145273 Last Update: 18/03/2014



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