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Datasheet

CY7C6431x, CY7C6434x, CY7C6435x: enCoRe™ V Full Speed USB Controller (PDF, 1.07 MB)
Datasheet updated: 05/04/2012

CY7C64345-32LQXCT

Development Kit CY3660
CPU Core M8C
Automotive Qualified N
Application Gaming Mice, Keyboard, Joystick
I/O Options USB, GPIO, SPI, CLKIN/OUT, Vreg, ADC, I2C
Data Transfers Bulk, Interrupt, Isochronous
Memory Architecture Flash
Memory Size (KB) 16
Min. Operating Voltage (V) 3.00
Max. Operating Voltage (V) 5.50
Min. Operating Temp. (°C) 0
Max. Operating Temp. (°C) 70
No. of I/Os 25

Pricing & Inventory Availability

1-10 unit Price*
11-100 unit Price*
101-1000 unit Price*
1001 + unit Price*
$3.62
$2.98
$2.42
$2.25

Availability
Quantity
Ships In
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Out of Stock 0 Please click here to check lead times Check Distributors

* Prices are shown in United States dollars and are for budgetary use only.


Packaging/Ordering

Package QFN
No. of Pins 32
Package Dimensions 196 L X 0.6 H X 196 W (Mils)
Package Weight 43.44 (mgs)
Package Cross Section Drawing Download
Package Carrier REEL
Package Carrier Drawing / Orientation Tape Drawing, Reel Drawing, Package Orientation
Standard Pack Quantity 2500
Minimum Order Quantity (MOQ) 2500
Order Increment 2500
Estimated Lead Time (days) 42
HTS Code 8542.31.0000
ECCN 3A991
ECCN Suball (A.3)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Ni/Pd/Au
Marking Cypress Marking Format
Package Material Declaration
32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 07/06/2012
IPC 1752 Material Declaration
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_AMKOR-PHIL_LQ Last Update: 07/04/2012
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CARSEM_LQ Last Update: 07/04/2012
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CML_LQ Last Update: 07/04/2012
QFN 32 - 001-80519 Last Update: 08/29/2012
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012
QFN - LQ24 - 001-79754 Last Update: 06/28/2012
LT56B - 001-79781 Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
001-70191_0A_V.pdf Last Update: 03/12/2012
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

Application Notes (1)
AN43353 - Using enCoRe™ V 16-Bit Timer Modules as PWMs Last Update: 16/02/2012
Technical Reference Manuals (1)
enCoRe™ V CY7C643xx, enCoRe™ V LV CY7C604xx Technical Reference Manual (TRM) Last Update: 11/09/2012
Product Change Notice (PCN) (6)
PCN125129 Last Update: 07/06/2012
PCN115072 Last Update: 19/07/2011
PCN104918 Last Update: 23/07/2010
PCN094815 Last Update: 23/07/2010
PCN094808 Last Update: 05/07/2010
PCN094786 Last Update: 21/04/2009
Product Information Notice (PIN) (1)
PCN125157 Last Update: 19/06/2012