CY7C64225-28PVXC
| CPU Core |
N/A |
| Automotive Qualified |
N |
| Application |
USB Full-Speed Peripherals |
| I/O Options |
USB, UART |
| Data Transfers |
Bulk, Interrupt, Control |
| Memory Architecture |
Flash |
| Memory Size (KB) |
N/A |
| Min. Operating Voltage (V) |
3.15 |
| Max. Operating Voltage (V) |
5.25 |
| Min. Operating Temp. (°C) |
0 |
| Max. Operating Temp. (°C) |
70 |
| No. of I/Os |
N/A |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$2.34 |
$1.95 |
$1.72 |
$1.71 |
Availability |
Quantity |
Ships In |
Order Now |
| In Stock |
395 |
24-48 hours |
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
SSOP |
| No. of Pins |
28 |
| Package Dimensions |
408 L X 0 H X 210 W (Mils) |
| Package Weight |
229.90 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TUBE
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
235 |
| Minimum Order Quantity (MOQ) |
235 |
| Order Increment |
235 |
| Estimated Lead Time (days) |
56 |
| HTS Code |
8542.31.0000
|
| ECCN |
3A991
|
| ECCN Suball |
(A.3)
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
N/A |
| Peak Reflow Temp. (°C) |
N/A (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au, Pure Sn |
| Marking |
Cypress Marking Format |
Package Material Declaration
28L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD)
Last Update: 07/16/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_SSOP 28_CML_NIPDAU
Last Update: 07/05/2012
IPC-1752-2_V1.1_SSOP 28_OSET_PURE SN
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP 20, 28) USING MOLD COMPOUND CEL9220HF, ADHESIVE 8340, PURE SN - OSE TAIWAN ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP20,28,48,56) QSOP (SQ20,24) SOIC (SZ18,24) TSOP (ZT32) USING MOLD COMPOUND KEG3000DA, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY
Last Update: 07/04/2012
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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|
|
Product Change Notice (PCN) (1)
PCN125156
Last Update: 18/06/2012
|
Product Information Notice (PIN) (2)
PIN135200
Last Update: 21/03/2013
PCN125157
Last Update: 19/06/2012
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