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CY7C64013C-SXCT Status: In Production Alert me about changes
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Datasheet

CY7C64013C, CY7C64113C: Full-Speed USB (12-Mbps) Function (PDF, 1.33 MB)
Datasheet updated: 04/22/2014

CY7C64013C-SXCT

Development Kit CY3654, CY3654-P03
Automotive Qualified N
Application USB Full-Speed Peripherals
I/O Options DAC Port, GPIO, HAPI, I2C, Programmable Drive
Data Transfers Bulk, Interrupt, Isochronous
Memory Architecture EPROM
Memory Size (KB) 8
Min. Operating Voltage (V) 3.15
Max. Operating Voltage (V) 3.45
Min. Operating Temp. (°C) 0
Max. Operating Temp. (°C) 70
No. of I/Os 19
CPU Core M8

Pricing & Inventory Availability

1-9
unit Price*
10-24
unit Price*
25-99
unit Price*
100-249
unit Price*
250-999
unit Price*
1000 +
unit Price*
$6.99
$6.04
$5.72
$4.77
$4.62
$4.31

Availability
Quantity
Ships In
Order Now
Out of Stock 0 Please click here to check lead times Check Distributors**

* Prices are shown in United States dollars and are for budgetary use only for volume of 1ku

** Check Distributors: This part is sold through distributors only.


Packaging/Ordering

Package SOIC
No. of Pins 28
Package Dimensions 705 L X 0 H X 300 W (Mils)
Package Weight 830.75 (mgs)
Package Cross Section Drawing Download
Package Carrier REEL
Package Carrier Drawing / Orientation Tape Drawing, Reel Drawing, Package Orientation
Standard Pack Quantity 1000
Minimum Order Quantity (MOQ) 1000
Order Increment 1000
Estimated Lead Time (days) 42
HTS Code 8542.31.0000
ECCN 3A991
ECCN Suball (A.3)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Ni/Pd/Au
Marking Cypress Marking Format
Package Material Declaration
28L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Last Update: 09/20/2014
IPC 1752 Material Declaration
IPC-1752-2_V1.1_SOIC 28_CML_NIPDAU_GREEN MC Last Update: 06/19/2014
SOIC 28 - 001-80414 Last Update: 08/29/2012
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - SOIC (SZ20,24,28,32) SOJ (VZ28,32,36,44) SNC (SY28) SSOP (SP48) USING MOLD COMPOUND KEG6000DA, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY Last Update: 07/03/2012
TSOP 28 - 001-79768 Last Update: 06/28/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
001-73182_0B_V.pdf Last Update: 10/23/2014
001-89482_0A_V.pdf Last Update: 10/03/2014
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

Application Notes (0)
Product Change Notice (PCN) (6)
PCN115095 Last Update: 19/10/2011
PCN105011 Last Update: 20/12/2010
PCN050862 Last Update: 18/08/2008
PCN060971 Last Update: 13/08/2008
PCN084676 Last Update: 12/08/2008
PCN071512 Last Update: 17/07/2008
Product Information Notice (PIN) (3)
PIN145281 Last Update: 20/03/2014
PIN145277 Last Update: 19/03/2014
PCN125157 Last Update: 19/06/2012

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