CY7C63823-QXC
| Development Kit |
CY3655
|
| CPU Core |
M8C |
| Automotive Qualified |
N |
| Application |
Mouse, Wireless Dongle |
| I/O Options |
USB, PS/2, SPI, GPIO |
| Data Transfers |
Interrupt |
| Memory Architecture |
Flash |
| Memory Size (KB) |
8 |
| Min. Operating Voltage (V) |
4.00 |
| Max. Operating Voltage (V) |
5.50 |
| Min. Operating Temp. (°C) |
0 |
| Max. Operating Temp. (°C) |
70 |
| No. of I/Os |
20 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$1.50 |
$1.25 |
$1.11 |
$1.10 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
QSOP |
| No. of Pins |
24 |
| Package Dimensions |
340 L X 1 H X 150 W (Mils) |
| Package Weight |
142.49 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TUBE
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
1925 |
| Minimum Order Quantity (MOQ) |
1925 |
| Order Increment |
1925 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.31.0000
|
| ECCN |
3A991
|
| ECCN Suball |
(A.3)
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
1 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au |
| Marking |
Cypress Marking Format |
Package Material Declaration
24L-QSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD)
Last Update: 07/09/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_QSOP24_CML CONVENTIONAL
Last Update: 07/04/2012
QSOP 24 - 001-80409
Last Update: 08/29/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP48,56) QSOP (SQ20,24) USING MOLD COMPOUND KEG3000DA, ADHESIVE QMI509, NIPDAU - JCET CHINA ASSEMBLY
Last Update: 07/03/2012
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP20,28,48,56) QSOP (SQ20,24) SOIC (SZ18,24) TSOP (ZT32) USING MOLD COMPOUND KEG3000DA, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (3)
PCN125157
Last Update: 19/06/2012
PCN104993
Last Update: 19/10/2010
PCN084642
Last Update: 17/07/2008
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