CY7C63803-LQXC
| CPU Core |
M8C |
| Automotive Qualified |
N |
| Application |
Mouse, Wireless Dongle |
| I/O Options |
USB, PS/2, SPI, GPIO |
| Data Transfers |
Interrupt |
| Memory Architecture |
Flash |
| Memory Size (KB) |
8 |
| Min. Operating Voltage (V) |
4.00 |
| Max. Operating Voltage (V) |
5.50 |
| Min. Operating Temp. (°C) |
0 |
| Max. Operating Temp. (°C) |
70 |
| No. of I/Os |
14 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$2.23 |
$1.83 |
$1.49 |
$1.39 |
Availability |
Quantity |
Ships In |
Order Now |
| In Stock |
10 |
24-48 hours |
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
QFN |
| No. of Pins |
24 |
| Package Dimensions |
157.5 L X 23.6 H X 157.5 W (Mils) |
| Package Weight |
31.33 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
980 |
| Minimum Order Quantity (MOQ) |
980 |
| Order Increment |
980 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.31.0000
|
| ECCN |
3A991
|
| ECCN Suball |
(A.3)
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au, Pure Sn |
| Marking |
Cypress Marking Format |
Package Material Declaration
24L - QFN 4.0 X 4.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD)
Last Update: 07/05/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1A_QFN24 _CARSEM_4X4MM_LQ
Last Update: 07/03/2012
IPC-1752-2_V1.1A_QFN24_AIT_4X4MM_LQ
Last Update: 07/05/2012
IPC-1752-2_V1.1A_QFN24_AMKOR-PHIL_4X4MM_LQ
Last Update: 07/03/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32) (LT56,68) USING MOLD COMPOUND G770, ADHESIVE CRM1064L, NIPDAU - UNISEM ASSEMBLY
Last Update: 07/04/2012
QFN - LQ24 - 001-79754
Last Update: 06/28/2012
LT56B - 001-79781
Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Package Qualification Report
001-70532_0A_V.pdf
Last Update: 03/12/2012
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (1)
PCN125157
Last Update: 19/06/2012
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