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Datasheet

CY7C604XX: enCoRe™ V Low Voltage Microcontroller (PDF, 0.46 MB)
Datasheet updated: 09/22/2011

CY7C60445-32LQXC

Development Kit CY3660
CPU Core M8C
Automotive Qualified N
Application Wireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications
Code Memory Architecture Flash
I/O Options GPIO, I2C, SPI, ADC
RAM Size (Bytes) 1024
Max. Operating Voltage (V) 3.60
Min. Operating Temp. (°C) 0
Max. Operating Temp. (°C) 70
No. of I/Os 28
Code Memory Size (KB) 16
Max. Speed (MHz) 24
Min. Operating Voltage (V) 1.71

Pricing & Inventory Availability

1-10 unit Price*
11-100 unit Price*
101-1000 unit Price*
1001 + unit Price*
$2.93
$2.41
$1.95
$1.82

Availability
Quantity
Ships In
Order Now
In Stock 90 24-48 hours

* Prices are shown in United States dollars and are for budgetary use only.


Packaging/Ordering

Package QFN
No. of Pins 32
Package Dimensions 196 L X 0.6 H X 196 W (Mils)
Package Weight 43.44 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Drawing, Package Orientation
Standard Pack Quantity 490
Minimum Order Quantity (MOQ) 490
Order Increment 490
Estimated Lead Time (days) 42
HTS Code 8542.31.0000
ECCN 3A991
ECCN Suball (A.3)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Ni/Pd/Au
Marking Cypress Marking Format
Package Material Declaration
32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 07/06/2012
IPC 1752 Material Declaration
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_AMKOR-PHIL_LQ Last Update: 07/04/2012
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CARSEM_LQ Last Update: 07/04/2012
IPC-1752-2_V1.1A_QFN32 5X5X0.6 MM_CML_LQ Last Update: 07/04/2012
QFN 32 - 001-80519 Last Update: 08/29/2012
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A,32,32A) (LT32B) USING MOLD COMPOUND CEL9220HF13, ADHEISVE QMI509, NIPDAU, CU WIRE - CML ASSEMBLY Last Update: 07/04/2012
QFN - LQ24 - 001-79754 Last Update: 06/28/2012
LT56B - 001-79781 Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LQ24A, 32) USING MOLD COMPOUND EMEG770H, ADHESIVE QMI519, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
001-70191_0A_V.pdf Last Update: 03/12/2012
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

Technical Reference Manuals (1)
enCoRe™ V CY7C643xx, enCoRe™ V LV CY7C604xx Technical Reference Manual (TRM) Last Update: 11/09/2012
Product Change Notice (PCN) (7)
PCN125129 Last Update: 07/06/2012
PCN115072 Last Update: 19/07/2011
PCN104918 Last Update: 23/07/2010
PCN094816 Last Update: 23/07/2010
PCN094815 Last Update: 23/07/2010
PCN094808 Last Update: 05/07/2010
PCN094786 Last Update: 21/04/2009
Product Information Notice (PIN) (1)
PCN125157 Last Update: 19/06/2012

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