CY7C60413-16LKXC
| Development Kit |
CY3660
|
| CPU Core |
M8C |
| Automotive Qualified |
N |
| Application |
Wireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications |
| Code Memory Architecture |
Flash |
| I/O Options |
GPIO, I2C, SPI, ADC |
| RAM Size (Bytes) |
1024 |
| Max. Operating Voltage (V) |
3.60 |
| Min. Operating Temp. (°C) |
0 |
| Max. Operating Temp. (°C) |
70 |
| No. of I/Os |
13 |
| Code Memory Size (KB) |
8 |
| Max. Speed (MHz) |
24 |
| Min. Operating Voltage (V) |
1.71 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$1.84 |
$1.53 |
$1.35 |
$1.34 |
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
QFN |
| No. of Pins |
16 |
| Package Dimensions |
118 L X 23 H X 118 W (Mils) |
| Package Weight |
15.57 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
490 |
| Minimum Order Quantity (MOQ) |
490 |
| Order Increment |
490 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.31.0000
|
| ECCN |
3A991
|
| ECCN Suball |
(A.3)
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au |
| Marking |
Cypress Marking Format |
Package Material Declaration
16L - QFN 3X3X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PMDD
Last Update: 07/05/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_QFN16_AMKOR PHIL_LG
Last Update: 07/04/2012
IPC-1752-2_V1.1_QFN16_CARSEM_LG
Last Update: 07/04/2012
IPC-1752-2_V1.1_QFN16_ASE TAIWAN_LG16A
Last Update: 07/31/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE ATB-120A, NIPDAU-AG - AMKOR KOREA (K1) ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE NEX130C, NIPDAU-AG - AMKOR PHILS. (P3) ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLYPACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E, LG16, LQ44) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLY
Last Update: 07/03/2012
PACKAGE ROHS ANALYSIS REPORT - QFN (16A) USING MOLD COMPOUND EMEG770H, ADHESIVE 8006NS, NIPDAU - CARSEM MALAYSIA ASSEMBLY
Last Update: 07/04/2012
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RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Package Qualification Report
QTP 112603 16 QFN (3x3x0.6mm) NiPdAu-Ag, MSL3, 260°C Reflow ASEK-Taiwan (G).pdf
Last Update: 07/16/2012
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (2)
PCN125157
Last Update: 19/06/2012
PCN115118
Last Update: 22/12/2011
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