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Datasheet

CY7C1302DV25: 9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture (PDF, 0.68 MB)
Datasheet updated: 06/06/2014

CY7C1302DV25-167BZXC

Automotive Qualified N
Architecture QDR
Min. Operating Voltage (V) 2.38
Max. Operating Voltage (V) 2.63
Min. Operating Temp. (°C) 0
Burst Length (Words) 2
Organization (X x Y) 512Kb x 18
Temp. Classification Commercial
Max. Operating VCCQ (V) 1.90
Min. Operating VCCQ (V) 1.40
Density (Kb) 9216
Frequency (MHz) 167
Max. Operating Temp. (°C) 70

Pricing & Inventory Availability

1-9
unit Price*
10-24
unit Price*
25-99
unit Price*
100-249
unit Price*
250-999
unit Price*
1000 +
unit Price*
$35.39
$31.56
$29.27
$26.97
$26.02
$24.87

Availability
Quantity
Ships In
Order Now
Out of Stock 0 Please click here to check lead times Check Distributors**

* Prices are shown in United States dollars and are for budgetary use only for volume of 1ku

** Check Distributors: This part is sold through distributors only.


Packaging/Ordering

Package FBGA
No. of Pins 165
Package Dimensions 591 L X 1.4 H X 512 W (Mils)
Package Weight 499.56 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Drawing, Package Orientation
Standard Pack Quantity 136
Minimum Order Quantity (MOQ) 136
Order Increment 136
Estimated Lead Time (days) 35
HTS Code 8542.32.0040
ECCN 3A991
ECCN Suball (B.2.A.)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Sn/Ag/Cu
Marking Cypress Marking Format
Package Material Declaration
165-FBGA (13 X 15 MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 09/30/2014
IPC 1752 Material Declaration
165-FBGA - 001-80436 Last Update: 06/25/2013
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BW165) USING MOLD COMPOUND CK7000LA, ADHESIVE QMI506 AND SAC405 - CML ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
QTP 050704_001-89474.pdf Last Update: 10/23/2013
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

Models (3)
CY7C1302DV25-BSDL Last Update: 13/11/2008
CY7C1302DV25-IBIS Last Update: 13/11/2008
CY7C1302DV25-Verilog Last Update: 13/11/2008
Product Change Notice (PCN) (2)
PCN125145 Last Update: 07/06/2012
PCN115055 Last Update: 06/05/2011
Product Information Notice (PIN) (3)
PIN145277 Last Update: 19/03/2014
PIN135200 Last Update: 21/03/2013
PCN125157 Last Update: 19/06/2012



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