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Datasheet

CY7C1148KV18, CY7C1150KV18: 18-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.0 Cycle Read Latency) (PDF, 0.84 MB)
Datasheet updated: 02/01/2013

CY7C1150KV18-400BZXI

Automotive Qualified N
Architecture DDR-II+ CIO
Min. Operating Voltage (V) 1.70
Max. Operating Voltage (V) 1.90
Min. Operating Temp. (°C) -40
Burst Length (Words) 2
Organization (X x Y) 512Kb x 36
Temp. Classification Industrial
Max. Operating VCCQ (V) 1.90
Min. Operating VCCQ (V) 1.40
Density (Kb) 18432
Frequency (MHz) 400
Max. Operating Temp. (°C) 85

Pricing & Inventory Availability

1-10 unit Price*
11-100 unit Price*
101-1000 unit Price*
1001 + unit Price*
$46.63
$38.04
$32.64
$31.29

Availability
Quantity
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Out of Stock 0 Please click here to check lead times Check Distributors

* Prices are shown in United States dollars and are for budgetary use only.


Packaging/Ordering

Package FBGA
No. of Pins 165
Package Dimensions 591 L X 1.4 H X 512 W (Mils)
Package Weight 499.56 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Drawing, Package Orientation
Standard Pack Quantity 136
Minimum Order Quantity (MOQ) 136
Order Increment 136
Estimated Lead Time (days) 42
HTS Code 8542.32.0040
ECCN 3A991
ECCN Suball (B.2.A.)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Sn/Ag/Cu
Marking Cypress Marking Format
Package Material Declaration
165-FBGA (13 X 15 MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 09/24/2012
IPC 1752 Material Declaration
165-FBGA - 001-80436 Last Update: 08/29/2012
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BW165) USING MOLD COMPOUND CK7000LA, ADHESIVE QMI506 AND SAC405 - CML ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
QTP-094002_001-69283.pdf Last Update: 07/12/2012
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

Models (3)
CY7C1150KV18 - Verilog Last Update: 18/01/2012
CY7C1150KV18 - IBIS Last Update: 18/01/2012
CY7C1150KV18 - BSDL Last Update: 18/01/2012
Product Change Notice (PCN) (3)
PCN125174 Last Update: 04/10/2012
PCN125145 Last Update: 07/06/2012
PCN115104 Last Update: 19/10/2011
Product Information Notice (PIN) (1)
PCN125157 Last Update: 19/06/2012